Hengeler Mueller advises Siltronic on EUR 200m financing agreement with European Investment Bank and other financing activities

Siltronic AG, one of the world’s largest silicon wafer manufacturers, has signed a EUR 200m financing agreement with European Investment Bank to support the development of the next generation of silicon wafers.

The proceeds will be used for research and development of the next generation of hyperpure silicon wafers and ingots, and for the upgrade of silicon wafer production in Freiberg, Saxony. Silicon wafers are the foundation of the modern semiconductor industry and the basis for chips in all electronic applications, be it computers, smartphones, electric cars or wind turbines.

Hengeler Mueller comprehensively advised Siltronic AG on the financing transaction. The team included partner Daniela Böning as well as associate Jennifer Ellen Klein (both Financing, Frankfurt). Inhouse Siltronic was represented by Senior Legal Counsel Marion Schuster-Opitsch.

The transaction marks the third time this year that Hengeler Mueller supported Siltronic AG with its financing activities. In summer, the team advised Siltronic on another cooperation with the Economic Development Board (EDB) of Singapore for the construction of a new production facility in Singapore, followed by the debut issue of a EUR 300m ESG-linked Schuldschein note.